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收起 展开封装/外壳 :
14-SOIC(0.154",3.90mm 宽)
16-DIP(0.300",7.62mm)
20-SOIC
20-SSOP(0.209",5.30mm 宽)
20-TSSOP(0.173",4.40mm 宽)
24-TSSOP(0.173",4.40mm 宽)
24-VFQFN 裸露焊盘
24-VFQFN 裸露焊盘,CSP
28-SOIC(0.295",7.50mm 宽)
28-SSOP(0.209",5.30mm 宽)
32-DIP(0.900",22.86mm)
36-TFBGA
48-LQFP
SOT-23-8
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供应商器件封装 :
14-SOIC
16-PDIP
20-SSOP
20-TSSOP
24-LFCSP-VQ (4x5)
24-TSSOP
24-VQFN (4x4)
28-SOIC W
28-SSOP
32-CDIP 底部铜焊
36-TFBGA(6x6)
48-LQFP(7x7)
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