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收起 展开制造商 :
Rohm SemiconductorIntersilAnalog Devices IncTexas InstrumentsSTMicroelectronicsON SemiconductorVishay SiliconixMicrel IncLinear TechnologyExar Corporation
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封装/外壳 :
14-SOIC(0.154",3.90mm 宽)
14-TSSOP (0.173",4.40mm 宽)裸露焊盘
16-SOIC(0.295",7.50mm 宽)
16-VFQFN 裸露焊盘
18-SOIC(0.295",7.50mm 宽)
28-SOIC(0.295",7.50mm 宽)
4-MLF®,QFN
4-UFBGA,WLCSP
4-UFDFN 裸露焊盘
4-UFDFN 裸露焊盘,4-TMLF®
4-UFDFN,4-TMLF®
4-WFBGA,WLCSP
6-TSSOP,SC-88,SOT-363
6-UDFN 裸露焊盘,CSP
6-WFBGA,WLCSP
8-SOIC(0.154",3.90mm Width)裸露焊盘
8-SOIC(0.154",3.90mm 宽)
8-TSSOP(0.173",4.40mm 宽)
8-UFDFN 裸露焊盘
8-VFDFN 裸露焊盘,8-MLF®
SC-74,SOT-457
SOT-23-6 细型,TSOT-23-6
TO-236-3,SC-59,SOT-23-3
TO-263-8,D²Pak(7 引线+接片),TO-263CA
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电压 - 电源 :
1.1 V ~ 3.6 V
1.1 V ~ 5.5 V
1.5 V ~ 5.5 V
1.65 V ~ 6.5 V
1.7 V ~ 5.5 V
1.8 V ~ 5.5 V
2.7 V ~ 5.5 V
3 V ~ 5.5 V
3.5 V ~ 28 V
4.5 V ~ 16 V
5 V ~ 12 V
6 V ~ 25 V
6V
8 V ~ 15 V
8 V ~ 32 V
9 V ~ 60 V
900 mV ~ 3.6 V
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供应商器件封装 :
14-HTSSOP
14-SOIC
16-QFN(4x4)
16-SOIC
18-SOP(宽型)
28-SOIC W
4-MLF®(1.2x1.2)
4-TDFN(1.2x1.6)
4-TMLF®(0.85x0.85)
4-TMLF®(1.2x1.6)
4-WLCSP (.95x1.03)
4-WLCSP(0.74x0.74)
4-WLCSP(0.76x0.76)
6-LFCSP-UD(2x2)
6-WLCSP(1.45x0.95)
8-MLF®(2x2)
8-SO
8-SO PowerPad
8-SOIC
8-SOIC N
8-SOP-J
8-TDFN(2x2)
8-TSSOP
DDPAK/TO-263-7
SC-70-6
SC-74
SOT-23-3(TO-236)
TSOT-23-6
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