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收起 展开制造商 :
NXP SemiconductorsSTMicroelectronicsMaxim IntegratedMicrosemi Analog Mixed Signal GroupInternational RectifierLinear Technology
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封装/外壳 :
16-DIP(0.300",7.62mm)
16-SOIC(0.154",3.90mm 宽)
16-SSOP(0.154",3.90mm 宽)
20-DIP(0.300",7.62mm)
20-SOIC(0.295",7.50mm 宽)
20-SSOP(0.154",3.90mm 宽)
20-TSSOP(0.173",4.40mm 宽)
24-SSOP(0.154",3.90mm 宽)
24-TSSOP(0.173",4.40mm 宽)
28-SOIC(0.295",7.50mm 宽)
28-SSOP(0.154",3.90mm 宽)
28-TSSOP(0.173",4.40mm 宽)
28-WFQFN 裸露焊盘
28-WQFN 裸露焊盘,28-HWQFN
32-WFQFN 裸露焊盘
48-LQFP
8-DIP(0.300",7.62mm)
8-SOIC(0.154",3.90mm 宽)
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