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收起 展开制造商 :
Cypress Semiconductor CorpMaxim IntegratedRohm SemiconductorSamsung Electro-Mechanics America, IncTexas InstrumentsXilinx Inc
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封装/外壳 :
132-BQFP
14-DIP(0.300",7.62mm)
144-LQFP
16-DIP(0.300",7.62mm)
16-SOIC(0.154",3.90mm 宽)
16-SOIC(0.295",7.50mm 宽)
16-TSSOP(0.173",4.40mm 宽)
20-DIP(0.300",7.62mm)
20-SOIC(0.295",7.50mm 宽)
20-TSSOP(0.173",4.40mm 宽)
28-DIP(0.600",15.24mm)
28-DIP(0.600",15.24mm)插口
28-LCC(J 形引线)
32-DIP(0.600",15.24mm)插口
44-QFP
56-VFBGA
56-VFQFN 裸露焊盘
68-LCC(J 形引线)
8-DIP(0.300",7.62mm)
8-SOIC(0.154",3.90mm 宽)
84-PLCC
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