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收起 展开封装/外壳 :
16-DIP(0.300",7.62mm)
16-SOIC(0.295",7.50mm 宽)
20-CDIP(0.300",7.62mm)窗口
20-DIP(0.300",7.62mm)
20-SOIC(0.295",7.50mm 宽)
28-CDIP(0.600",15.24mm)
28-DIP(0.600",15.24mm)
28-SOIC(0.295",7.50mm 宽)
28-VFQFN,CSP
40-DIP(0.600",15.24mm)
40-DIP(0.600",15.24mm)窗口
44-LCC(J 形引线)
44-WFQFN 裸露焊盘
48-TFSOP(0.240",6.10mm 宽)
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