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收起 展开封装/外壳 :
14-DIP(0.300",7.62mm)
14-SOIC(0.154",3.90mm 宽)
16-DIP(0.300",7.62mm)
16-SOIC(0.295",7.50mm 宽)
16-SSOP(0.154",3.90mm 宽)
20-SOIC(0.295",7.50mm 宽)
20-SOIC(0.295",7.50mm 宽)裸露焊盘
20-TSSOP(0.173",4.40mm 宽)裸露焊盘
24-SSOP(0.154",3.90mm 宽)
28-SSOP(0.209",5.30mm 宽)
32-VFQFN 裸露焊盘,CSP
8-SOIC(0.154",3.90mm 宽)
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