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收起 展开封装/外壳 :
16-DIP(0.300",7.62mm)
16-SOIC(0.154",3.90mm 宽)
16-SOIC(0.295",7.50mm 宽)
20-TSSOP(0.173",4.40mm 宽)
24-SOIC(0.295",7.50mm 宽)
24-TSSOP(0.173",4.40mm 宽)
24-TSSOP(0.173",4.40mm)裸露焊盘
28-LCC(J 形引线)
28-SOIC(0.173",4.40mm 宽)裸露焊盘
28-SOIC(0.295",7.50mm 宽)
28-TSSOP(0.173",4.40mm 宽)
36-BSOP(0.295",7.50mm 宽)
36-QSOP
36-SOP
48-LQFP
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