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收起 展开封装/外壳 :
16-SOIC(0.295",7.50mm 宽)
24-DIP(0.300",7.62mm)
28-DIP(0.300",7.62mm)
28-DIP(0.600",15.24mm)
28-LSSOP(0.220",5.60mm 宽)
28-SOIC(0.295",7.50mm 宽)
28-SSOP(0.209",5.30mm 宽)
36-WFQFN 裸露焊盘
44-LCC(J 形引线)
48-LQFP
48-TQFP
48-WFQFN 裸露焊盘
8-TSSOP(0.173",4.40mm 宽)
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