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收起 展开制造商 :
Analog Devices IncAtmelFreescale SemiconductorIDT, Integrated Device Technology IncMaxim IntegratedMicrochip TechnologyRohm SemiconductorSemtechSTMicroelectronicsTexas Instruments
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包装 :
*
*可替代的包装
-
Digi-Reel®
Digi-Reel®可替代的包装
剪切带 (CT)
剪切带 (CT)可替代的包装
带卷 (TR)
带卷 (TR)可替代的包装
托盘
托盘可替代的包装
散装
管件
管件可替代的包装
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工作温度 :
所有封装/外壳 :
12-UFBGA,DSBGA
12-UFBGA,WLCSP
12-WFBGA,WLCSP
12-WQFN 裸露焊盘
120-VFBGA
14-WFDFN 裸露焊盘
16-QFN
16-SSOP(0.154",3.90mm 宽)
16-TSSOP(0.173",4.40mm 宽)
16-VFQFN 裸露焊盘
16-VQFN 裸露焊盘
16-VQFN 裸露焊盘,CSP
16-WQFN 裸露焊盘,CSP
20-SOIC(0.295",7.50mm 宽)
20-SSOP(0.209",5.30mm 宽)
20-TSSOP(0.173",4.40mm 宽)
20-VFQFN 裸露焊盘
20-VQFN 裸露焊盘
20-WFQFN 裸露焊盘
24-UFBGA,DSBGA
25-UFBGA,CSPBGA
25-UFBGA,WLCSP
28-SOIC(0.295",7.50mm 宽)
28-SSOP(0.154",3.90mm 宽)
28-TSSOP(0.173",4.40mm 宽)
28-UFBGA,DSBGA
28-VFQFN 裸露焊盘
28-WFQFN 裸露焊盘
32-TSSOP(0.240",6.10mm 宽)
32-VFQFN 裸露焊盘
32-VFQFN 裸露焊盘,CSP
32-WFQFN 裸露焊盘
44-LCC(J 形引线)
44-TQFP
44-WFQFN 裸露焊盘
48-TFSOP(0.240",6.10mm 宽)
48-VFBGA
48-VFQFN 裸露焊盘
64-TQFP
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电压 - 电源 :
1.2 V ~ 3.6 V
1.6 V ~ 3.6 V
1.65 V ~ 3.6 V
1.65 V ~ 3.7 V
1.7 V ~ 3.6 V
1.8 V ~ 3.3 V
1.8V, 3.3V
1.8V,3V
2.2 V ~ 5.25 V
2.3 V ~ 3.6 V
2.38 V ~ 5.25 V
2.5 V ~ 5 V
2.5 V ~ 5.25 V
2.7 V ~ 3.6 V
2.7 V ~ 5 V
2.7 V ~ 5.25 V
2.7 V ~ 5.5 V
3 V ~ 3.6 V
3 V ~ 5.5 V
3.3 V ~ 5 V
4.75 V ~ 5.25 V
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电流 - 电源 :
1µA
1.25mA
10mA
10nA
11.5mA
17mA
2.5µA
226.2µA
25mA
280µA
4mA
500µA
500nA
5mA
65µA
650µA
68µA
780µA
82µA
970µA
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供应商器件封装 :
12-CSP(2.17x1.67)
12-DSBGA(1.53x1.98)
12-TQFN-EP(4x4)
12-WLCSP(1.51x2.01)
12-WLCSP(1.54x2.02)
12-WLP
120-BGA Microstar Junior(6x6)
14-DFN(4x3)
16-LFCSP-VQ (4x4)
16-LFCSP-WQ(3x3)
16-QFN-EP(3x3)
16-QFN(3x3)
16-QSOP
16-SSOP
16-TSSOP
16-VQFN
16-VQFN(4x4)
20-QFN 裸露焊盘(4x4)
20-QFN(4x4)
20-QFN(5x5)
20-SOIC
20-SOIC W
20-SSOP
20-TQFN(4x4)
20-TSSOP
24-DSBGA(2.57x2.57)
25-WLCSP
28-DSBGA
28-QFN
28-QSOP
28-SOIC
28-TQFN (5x5)
28-TSSOP
32-LFCSP-VQ(5x5)
32-QFN 裸露焊盘(5x5)
32-TSSOP
32-WQFN(5x5)
44-LLP-EP(7x7)
44-PLCC(16.51x16.51)
44-TQFP(10x10)
48-BGA MICROSTAR JUNIOR(4x4)
48-TSSOP
48-VQFN(7x7)
64-TQFP(10x10)
VCSP50L2
模块
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