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收起 展开封装/外壳 :
20-TSSOP(0.173",4.40mm 宽)
24-SSOP(0.154",3.90mm 宽)
28-SSOP(0.209",5.30mm 宽)
28-TSSOP(0.173",4.40mm 宽)
32-VFQFN 裸露焊盘
32-WFQFN 裸露焊盘,CSP
40-VFQFN 裸露焊盘
48-BSSOP(0.295",7.50mm 宽)
48-TFSOP(0.240",6.10mm 宽)
48-VFQFN 裸露焊盘
56-BSSOP(0.295",7.50mm 宽)
56-TFSOP(0.240",6.10mm 宽)
64-TFSOP (0.240",6.10mm 宽)
64-VFQFN 裸露焊盘
72-VFQFN 裸露焊盘
8-SOIC(0.154",3.90mm 宽)
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供应商器件封装 :
20-TSSOP
24-SSOP/QSOP
28-SSOP
28-TSSOP
32-LFCSP-WQ(5x5)
32-VFQFPN(5x5)
40-VFQFPN(6x6)
48-QFN(6x6)
48-SSOP
48-TSSOP
56-SSOP
56-TSSOP
64-TSSOP
64-VFQFPN(9x9)
72-VFQFPN(10x10)
8-SOIC
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主要用途 :
AMD CPU
ATOM® CPU,PCI Express(PCIe)
Brookdale Mobile
Intel CK505,PCI Express(PCIe)
Intel CPU 服务器
Intel CPU 服务器,PCI Express(PCIe),SATA
Intel CPU,PCI Express(PCIe)
Intel CPU,PCI Express(PCIe),Timing Control Hub™
Intel CPU,Timing Control Hub™
Intel QPI,PCI Express(PCIe)
PCI Express(PCIe)
以太网,GPON,SONET/SHD,T1/E1
存储器,RDRAM
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