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收起 展开封装/外壳 :
16-TSSOP(0.173",4.40mm 宽)
20-SSOP(0.154",3.90mm 宽)
20-TSSOP(0.173",4.40mm 宽)
20-VFQFN 裸露焊盘
28-SSOP(0.209",5.30mm 宽)
28-TSSOP(0.173",4.40mm 宽)
40-WFQFN 裸露焊盘,CSP
48-BSSOP(0.295",7.50mm 宽)
48-TFSOP(0.240",6.10mm 宽)
64-TFSOP (0.240",6.10mm 宽)
72-VFQFN 裸露焊盘
8-SOIC(0.154",3.90mm 宽)
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供应商器件封装 :
16-TSSOP
20-QSOP
20-TSSOP
20-VFQFPN(4x4)
28-SSOP
28-TSSOP
40-LFCSP-WQ(6x6)
48-SSOP
48-TSSOP
64-TSSOP
72-VFQFPN(10x10)
8-SOIC
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