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收起 展开封装/外壳 :
14-DIP(0.300",7.62mm)
14-SOIC(0.154",3.90mm 宽)
14-SOIC(0.209",5.30mm 宽)
6-WFDFN 裸露焊盘
7-LSSOP(0.11",2.80mm 宽)
8-TSSOP,8-MSOP(0.110",2.80mm 宽)
8-TSSOP,8-MSOP(0.118",3.00mm 宽)
8-VFSOP(0.091",2.30mm 宽)
8-XFBGA,DSBGA
8-XFDFN
8-XFQFN 裸露焊盘
SOT-23-6 细型,TSOT-23-6
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