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收起 展开封装/外壳 :
16-DIP(0.300",7.62mm)
16-SOIC(0.154",3.90mm 宽)
16-SOIC(0.209",5.30mm 宽)
16-SSOP(0.209",5.30mm 宽)
16-TFSOP (0.173",4.40mm 宽)
16-TSSOP(0.173",4.40mm 宽)
16-VFQFN 裸露焊盘
7-LSSOP(0.11",2.80mm 宽)
8-VFSOP(0.091",2.30mm 宽)
8-XFBGA,DSBGA
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