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所有封装/外壳 :
20-DIP(0.300",7.62mm)
20-SOIC(0.209",5.30mm 宽)
20-SOIC(0.295",7.50mm 宽)
20-SSOP(0.209",5.30mm 宽)
20-TFSOP(0.173",4.40mm 宽)
20-TSSOP(0.173",4.40mm 宽)
20-VFBGA
20-VFQFN 裸露焊盘
20-XFQFN 裸露焊盘
24-SOIC(0.295",7.50mm 宽)
24-SSOP(0.209",5.30mm 宽)
24-TFSOP(0.173",4.40mm 宽)
24-TSSOP(0.173",4.40mm 宽)
24-VFQFN 裸露焊盘
48-BSSOP(0.295",7.50mm 宽)
48-TFSOP(0.173",4.40mm 宽)
48-TFSOP(0.240",6.10mm 宽)
56-VFBGA
96-LFBGA
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供应商器件封装 :
20-BGA MICROSTAR JUNIOR(4x3)
20-DHVQFN(4.5x 2.5)
20-PDIP
20-SO
20-SOIC
20-SOP
20-SSOP
20-TSSOP
20-TVSOP
20-VQFN (3.5x4.5)
24-DHVQFN(5.5x3.5)
24-SO
24-SOIC
24-SSOP
24-TSSOP
24-TVSOP
48-SSOP
48-TSSOP
48-TVSOP
56-BGA MICROSTAR JUNIOR(7.0x4.5)
96-LFBGA(13.5x5.5)
96-PBGA MICROSTAR(13.6x5.6)
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